ePlace-3D: Electrostatics based Placement for 3D-ICs

12/27/2015

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by   Jingwei Lu, et al.

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We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform smoothness (2) 3D numerical solution with improved spectral formulation (3) 3D nonlinear pre-conditioner for convergence acceleration (4) interleaved 2D-3D placement for efficiency enhancement. Our placer outperforms the leading work mPL6-3D and NTUplace3-3D with 6.44 and 10.27 circuits. Validation on the large-scale modern mixed-size (MMS) 3D circuits shows high performance and scalability.